MECHANISM OF TARNISHING OF PRECIOUS-METAL CONTACT ALLOYS

被引:11
作者
ABBOTT, WH
机构
[1] Columbus Laboratories, Battelle Memorial Institute, Columbus
来源
IEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGING | 1969年 / PMP5卷 / 04期
关键词
D O I
10.1109/TPMP.1969.1136073
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Studies of the tarnishing of the Au–Ag, Au–Cu, Pd–Ag, and Pd–Cu systems revealed that film formation was controlled by diffusion either in the surface film or in the near-surface region of the alloy. Tarnishing of the silver-containing alloys is controlled by alloy diffusion, which can be described as a two-stage process. Initially, all alloys tarnish at nearly a linear rate characteristic of the pure reactive element. Beyond a transition thickness, the alloys tarnish according to a cubic-rate law. The rate-controlling mechanism associated with the simple cubic rate was identified as “short-circuit” diffusion via dislocations and/or grain boundaries. The two tarnish characteristics of an alloy such as Au–Ag were shown to be greatly affected by the surface metallurgical condition. © 1969, IEEE. All rights reserved.
引用
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页码:156 / &
相关论文
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ABBOTT WH, 1968 P HOLM SEM, P53
[2]  
CAMPBELL WE, 1968 P HOLM SEM, P265
[3]  
CAMPBELL WH, PRIVATE COMMUNICATIO
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