EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORS

被引：32
作者：
AGARWALA, BN
PATNAIK, B
SCHNITZE.R
机构：
来源：
JOURNAL OF APPLIED PHYSICS | 1972年 / 43卷 / 04期
关键词：
D O I：
10.1063/1.1661346
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：1487 / &
相关论文
共 11 条
[1]  
ATTARDO MJ, 1970, J APPL PHYS, V41, P2382
[2]   GRAIN-BOUNDARY DIFFUSION OF GOLD IN COPPER [J].
AUSTIN, AE ;
RICHARD, NA .
JOURNAL OF APPLIED PHYSICS, 1962, 33 (12) :3569-&
[3]   SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J].
BERENBAUM, L ;
ROSENBERG, R .
THIN SOLID FILMS, 1969, 4 (03) :187-+
[4]   STUDY OF FAILURE MECHANISMS IN AL-CU THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPY [J].
BERENBAUM, L ;
PATNAIK, B .
APPLIED PHYSICS LETTERS, 1971, 18 (07) :284-+
[5]   ELECTROMIGRATION IN THIN AL FILMS [J].
BLECH, IA ;
MEIERAN, ES .
JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) :485-&
[6]   EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J].
DHEURLE, FM .
METALLURGICAL TRANSACTIONS, 1971, 2 (03) :683-&
[7]  
HIRSCH PB, 1965, ELECTRON MICROS, P455
[8]  
LEYMONIE C, 1960, MEM SCI REV MET, V57, P285
[9]  
ROSENBERG RN, UNPUBLISHED
[10]  
Schintlmeister W., 1970, Planseeberichte fur Pulvermetallurgie, V18, P3
12