A new technique for etching boron-doped homoepitaxial diamond films was used to fabricate mesa-isolated recessed gate field-effect transistors that operate at temperatures up to 350-degrees-C. The upper temperature range is limited by the gate leakage current The room-temperature hole concentration and mobility of the diamond film active layer were 1.2 X 10(13) cm-3 and 280 cm2 / V . s, respectively. The maximum transconductance was 87-mu-S / mm at 200-degrees-C.