RECRYSTALLIZATION OF STRAINED GEXSI1-X SI LAYERS WITH VARIOUS GE GRADIENTS AND IN THE PRESENCE OF IMPURITIES

被引:1
作者
CORNI, F
TONINI, R
BALBONI, R
VESCAN, L
机构
[1] CNR, IST LAMEL, BOLOGNA, ITALY
[2] FORSCHUNGSZENTRUM JULICH, FORSCHUNGSZENTRUM, INST SCHICHT & IONENTECH, JULICH, GERMANY
来源
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 1994年 / 28卷 / 1-3期
关键词
CRYSTALLIZATION; INTERFACE ROUGHNESS; STRAINED GEXSI1-X; EPITAXY OF THIN FILMS;
D O I
10.1016/0921-5107(94)90005-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The recrystallization of amorphous GexSi1-x thin films on Si with uniform and with increasing Ge content is studied. The amorphous-crystal interface roughness is modified by the presence of C and O impurities before entering the GexSi1-x layer. The crystallization kinetics are heavily affected by the resulting interface morphology. A minimum velocity is found in the region of the impurities where the interface starts to roughen; the strain effect induced by the Ge within the GexSi1-x is overcome and the crystallization proceeds according to kinetics very similar to those for pure Si.
引用
收藏
页码:9 / 13
页数:5
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