TEMPERATURE-COMPENSATED COMPOSITE THIN-FILM RESISTORS

被引:0
作者
STEINBRUCHEL, C
RAZBORSEK, A
机构
[1] METTLER INSTRUMENTE AG,CH-8606 GREIFENSEE,SWITZERLAND
[2] RENSSELAER POLYTECH INST,CTR INTEGRATED ELECTR,TROY,NY 12180
关键词
D O I
10.1063/1.1141855
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
A method for producing temperature-compensated thin-film resistors is described that involves a conductor with negative temperature coefficient of resistance (TCR) partially overlayed by another conductor with positive TCR. The temperature dependence of the resistance of the composite film is evaluated to second order in temperature. It is found that when the geometry and the materials parameters of the composite film are chosen such that the first order TCR is zero, the second-order coefficient is not negligible for temperature variations of practical importance. The model predictions are in good agreement with experimental results using TaN and Ni as the two conductors, in which case the second-order coefficient turns out to be about 5×10- 7°C2. This also means that a first-order TCR of zero can only be achieved at a specified temperature.
引用
收藏
页码:2655 / 2658
页数:4
相关论文
共 10 条
[1]   STRUCTURAL AND ELECTRICAL-PROPERTIES OF STABLE NI/CR THIN-FILMS [J].
AU, CL ;
JACKSON, MA ;
ANDERSON, WA .
JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (04) :301-306
[2]   AL-DOPED NI-CR FOR TEMPERATURE-COEFFICIENT OF RESISTANCE CONTROL IN HYBRID THIN-FILM RESISTORS [J].
BAYNE, MA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06) :3142-3145
[3]   THIN-FILM NICR RESISTOR [J].
BUCZEK, DM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :370-372
[4]  
COLLINS F, 1986, MAY EL COMP C SEATTL
[5]   SPUTTERED NI-CR-BASED RESISTORS TERMINATED ON SPUTTERED ALUMINUM AND SCREEN-PRINTED PT-AG CONDUCTORS [J].
GIANI, E ;
LEUNG, SM .
THIN SOLID FILMS, 1986, 145 (01) :1-15
[6]  
GORECKADRZAZGA A, 1982, THIN SOLID FILMS, V92, P111
[7]   THIN-FILM SYSTEMS FOR LOW TCR RESISTORS [J].
RAZBORSEK, A ;
SCHWAGER, F .
VACUUM, 1988, 38 (8-10) :689-692
[8]   PLASMATRON SPUTTERING FOR THE PRODUCTION OF HIGH-STABILITY NICR RESISTIVE FILMS [J].
SCHILLER, S ;
HEISIG, U ;
GOEDICKE, K ;
BILZ, H ;
HENNEBERGER, J ;
BRODE, W ;
DIETRICH, W .
THIN SOLID FILMS, 1984, 119 (02) :211-216
[9]   PROPERTIES OF EVAPORATED NI-CR FILMS WITH AN ALUMINUM CONTENT OF ABOUT 50-PERCENT [J].
SCHIPPEL, E .
THIN SOLID FILMS, 1985, 123 (01) :57-62
[10]   TERNARY ALLOY-FILMS OF NI-CR-AL FOR THIN-FILM RESISTORS [J].
SCHIPPEL, E .
THIN SOLID FILMS, 1987, 146 (02) :133-138