AN EXTENSION OF BURCKHARDTS ANALYSIS OF VARACTOR MULTIPLIERS TO PUNCH-THROUGH CASE

被引：1
作者：
RYDER, RM
CAMPAGNA, RL
机构：
来源：
PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS | 1968年 / 56卷 / 05期
关键词：
D O I：
10.1109/PROC.1968.6429
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：880 / &
相关论文
共 50 条
[11]   Finite element analysis of punch-through mitigation with perforation [J].
Gao Pan ;
Liu Xiu-li ;
Duan Meng-lan ;
Li Ming-jie .
ROCK AND SOIL MECHANICS, 2016, 37 :563-569
[12]   COMPARISON OF THE PUNCH-THROUGH AND NON-PUNCH-THROUGH IGT STRUCTURES [J].
YILMAZ, H ;
BENJAMIN, JL ;
DYER, RF ;
CHEN, LSS ;
VANDELL, WR ;
PIFER, GC .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 1986, 22 (03) :466-470
[13]   CUTOFF FREQUENCY OF PUNCH-THROUGH DIODES [J].
VENDELIN, GD .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (03) :313-&
[14]   TEMPERATURE DEPENDENCE OF PUNCH-THROUGH VOLTAGE [J].
STUPELMA.VS .
SOVIET PHYSICS SEMICONDUCTORS-USSR, 1971, 5 (01) :141-&
[15]   TEMPERATURE STABILITY OF PUNCH-THROUGH DIODES [J].
COGAN, DD ;
VANDEROER, TG .
SOLID-STATE ELECTRONICS, 1978, 21 (06) :897-900
[16]   SCHOTTKY EFFECT IN PUNCH-THROUGH DIODES [J].
VANDEROER, TG .
JOURNAL OF APPLIED PHYSICS, 1977, 48 (09) :3835-3837
[17]   PUNCH-THROUGH DIODE AS A POWER DEVICE [J].
DECOGAN, D .
IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION, 1980, 127 (02) :67-71
[18]   Study on jackup spudcan punch-through [J].
Leung, C. F. ;
Teh, K. L. ;
Chow, Y. K. .
SOFT SOIL ENGINEERING, 2007, :291-298
[19]   ANALYSIS OF VARACTOR MULTIPLIERS WITH IDLERS [J].
SCANLAN, JO ;
LAYBOURN, PJ .
RADIO AND ELECTRONIC ENGINEER, 1966, 31 (06) :359-+
[20]   Avalanche photodiode punch-through gain determination through excess noise analysis [J].
Liu, Han-Din ;
Pan, Huapu ;
Hu, Chong ;
McIntosh, Dion ;
Lu, Zhiwen ;
Campbell, Joe ;
Kang, Yimin ;
Morse, Mike .
JOURNAL OF APPLIED PHYSICS, 2009, 106 (06)
12345