WHAT KINDS OF SOI WAFERS ARE SUITABLE FOR WHAT MICROMACHINING PURPOSES

被引:5
作者
KANDA, Y
机构
[1] Department of Electrical and Electronic Engineering, Faculty of Engineering, Toyo University, Kujirai, Kawagoe, Saitama
关键词
D O I
10.1016/0924-4247(92)85004-L
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Commercially available SOI (silicon-on-insulator) wafers of SIMOX (separation by implanted oxygen), ZMR (zone melting recrystallization) and bonded types are compared from the viewpoint of applications to sensors and actuators (S & A). These are whole-wafer-scale SOIs. Other localized SOI technologies are also discussed. SOI wafers are especially attractive for smart power S & A, as each component is dielectrically isolated. Single-crystal silicon mobile elements, such as diaphragms, cantilevers, bridges, rotors, valves, etc., can be fabricated by the sacrificial layer technique. SIMOX provides the thinnest single-crystal silicon element, which promises the highest natural frequency and the greatest flexibility.
引用
收藏
页码:211 / 215
页数:5
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