STRESSES AND DEFORMATION PROCESSES IN THIN-FILMS ON SUBSTRATES
被引:506
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作者:
DOERNER, MF
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机构:
IBM CORP,DIV GEN PROD,SAN JOSE,CA 95114IBM CORP,DIV GEN PROD,SAN JOSE,CA 95114
DOERNER, MF
[1
]
NIX, WD
论文数: 0引用数: 0
h-index: 0
机构:
IBM CORP,DIV GEN PROD,SAN JOSE,CA 95114IBM CORP,DIV GEN PROD,SAN JOSE,CA 95114
NIX, WD
[1
]
机构:
[1] IBM CORP,DIV GEN PROD,SAN JOSE,CA 95114
来源:
CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES
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1988年
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14卷
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03期
关键词:
This work was supported in part by the Directorate of Electronic and Materials Sciences of the Air Force Office of Scientific Research under Grant No. AFOSR 86-0051 and by the NSF-MRL Program at Stanford University through the Thin-Films Thrust Program of the Center for Materials Research. The authors gratefully acknowledge the assistance of Prof. D. M. Barnett in solving several diffusion problems associated with the development of intrinsic stress by vacancy annihilation;