A BASIC STUDY ON VIBRATION MULTI-WIRE SAWING USING WIRE FIXED DIAMOND GRAINS

被引：0
|
作者：
ISHIKAWA, K
SUWABE, H
机构：
[1] Kanazawa Inst of Technology, Kanazawa, Jpn, Kanazawa Inst of Technology, Kanazawa, Jpn
来源：
BULLETIN OF THE JAPAN SOCIETY OF PRECISION ENGINEERING | 1987年 / 21卷 / 03期
关键词：
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
2
引用
收藏
页码：214 / 216
页数：3
相关论文
共 50 条
  • [31] Study on the wear of diamond beads in wire sawing
    Huang, Hui
    Xu, Xipeng
    ADVANCES IN MATERIALS MANUFACTURING SCIENCE AND TECHNOLOGY II, 2006, 532-533 : 436 - +
  • [32] SAWING MARBLE WITH DIAMOND WIRE
    HALLEZ, CP
    INDUSTRIAL DIAMOND REVIEW, 1971, 31 (362): : 8 - &
  • [33] Investigation on the sawing temperature in ultrasonic vibration assisted diamond wire sawing monocrystalline silicon
    Wang, Yan
    Song, Li-Xing
    Liu, Jian-Guo
    Wang, Rui
    Zhao, Bo-Cheng
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2021, 135 (135)
  • [34] Experimental study of free abrasive wire sawing by using multi-strands wire
    Yao Chunyan
    Wang Jinsheng
    Peng Wei
    Jin Xin
    Chen Shijie
    Engineering Sciences, 2013, 11 (06) : 80 - 84
  • [35] Study on surface integrity of solar cell wafers by using free abrasive electrochemical multi-wire sawing method
    College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing
    210016, China
    不详
    210016, China
    Jixie Gongcheng Xuebao, 11 (201-206):
  • [36] Theoretical and Experimental Research on Machining Movement of Multi-wire Sawing with Rocking and Reciprocating
    Yang Q.
    Huang H.
    Zheng S.
    Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2020, 56 (11): : 219 - 228
  • [37] Machining accuracy and force characteristic of diamond wire sawing and diamond wire electrical discharge sawing during rip sawing and cross sawing
    Qiu, Jian
    Lv, Jianzhuang
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2023, 126 (1-2): : 697 - 707
  • [38] Machining accuracy and force characteristic of diamond wire sawing and diamond wire electrical discharge sawing during rip sawing and cross sawing
    Jian Qiu
    Jianzhuang Lv
    The International Journal of Advanced Manufacturing Technology, 2023, 126 : 697 - 707
  • [39] Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing
    Liu, Tengyun
    Su, Yancai
    Ge, Peiqi
    MICROMACHINES, 2022, 13 (11)
  • [40] Experimental investigation on cutting mechanisms in fixed diamond wire sawing of bone
    Yan, Lutao
    Wang, Qi
    Li, Haiyuan
    Zhang, Qinjian
    PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2021, 68 : 319 - 325
12345