DEVELOPMENT OF WATER-SOLUBLE SYSTEMS FOR USE IN INDUSTRIAL SOLDERING PROCESSES

被引：6

作者：

SCHUESSLER, PW

PETERS, HG

POLIAK, RM

机构：

来源：

关键词：

D O I：

10.1147/rd.166.0592

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：592 / +

页数：1

相关论文

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[4]

MILLER SS, 1970, ENVIRON SCI TECHNOL, V4, P887

[5]

POLIAK RM, 1969, Patent No. 3436278

[6] CORROSIVE EFFECTS OF SOLDER FLUX ON PRINTED-CIRCUIT BOARDS [J].

RAFFALOVICH, AJ .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1971, PHP7 (04) :155-+

[7]

SAX NI, 1968, DANGEROUS PROPERTIES

[8]

1969, PURE WATERS GUIDELIN