USE OF ORGANIC ADDITIVES TO STABILIZE AND ENHANCE DEPOSITION RATE OF ELECTROLESS COPPER PLATING

被引：47

作者：

SCHOENBERG, LN

机构：

来源：

关键词：

Compendex;

D O I：

10.1149/1.2404029

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

ELECTROLESS PLATING

引用

页码：1491 / +

页数：1

共 16 条

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FELDSTEIN, N
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (06) : 869 - +
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[5] GUTZEIT G, 1959, ASTM265 SPEC TECHN P
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[10] OKINAKA Y, UNPUBLISHED WORK