THE USE OF ION-BOMBARDMENT FOR PLATING METAL CONTACTS ONTO SEMICONDUCTORS

被引：4
|
作者：
ENGLAND, AA
RHODERICK, EH
机构：
来源：
SOLID-STATE ELECTRONICS | 1981年 / 24卷 / 04期
关键词：
D O I：
10.1016/0038-1101(81)90028-9
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：337 / 342
页数：6
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