COPPER-BASED METALLIZATION IN ULSI STRUCTURES .2. IS CU AHEAD OF ITS TIME AS AN ON-CHIP INTERCONNECT MATERIAL

被引：95
作者：
LI, J
SEIDEL, TE
MAYER, JW
机构：
[1] ARIZONA STATE UNIV,CTR SOLID STATE SCI,TEMPE,AZ 85287
[2] SEMATECH,AUSTIN,TX
来源：
MRS BULLETIN | 1994年 / 19卷 / 08期
关键词：
D O I：
10.1557/S0883769400047692
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：15 / 18
页数：4
相关论文
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