DOPANT INCORPORATION IN EPITAXIAL GERMANIUM GROWN ON GE(100) SUBSTRATES BY MBE

被引:7
作者
KESAN, VP
IYER, SS
COTTE, JM
机构
[1] IBM Research Division, T.J. Watson Research Center, Yorktown Heights
关键词
D O I
10.1016/0022-0248(91)91095-R
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
We have conducted the first studies of dopant incorporation (gallium, boron, and antimony) in MBE germanium grown on Ge(100) substrates. Excellent germanium films have been grown on Ge substrates with little demarcation of the substrate-epi interface. A first order kinetic incorporation model has been used to describe the behavior of gallium in germanium. Gallium doping of germanium takes place through an adlayer at the growth front and between growth temperatures of 450 and 550-degrees-C successful p-doping of germanium by gallium can be accomplished. Boron is an excellent p-dopant in germanium with good activation at high concentrations and sharp transition profiles. The incorporation of antimony in germanium at growth temperatures greater-than-or-equal-to 450-degrees-C is poor and needs further investigation.
引用
收藏
页码:847 / 855
页数:9
相关论文
共 6 条
[1]   PNP GAAS/GE/GE PHOTOTRANSISTOR GROWN BY MOLECULAR-BEAM EPITAXY - IMPLICATIONS FOR BIPOLAR AND HOT-ELECTRON TRANSISTORS [J].
CHAND, N ;
KLEM, J ;
MORKOC, H .
APPLIED PHYSICS LETTERS, 1986, 48 (07) :484-486
[2]   HETEROJUNCTION BAND DISCONTINUITY GROWTH SEQUENCE VARIATION AT COMPOUND SEMICONDUCTOR-GERMANIUM (110) INTERFACES - POSSIBLE ROLE OF ANTIPHASE DISORDER [J].
GRANT, RW ;
WALDROP, JR ;
KOWALCZYK, SP ;
KRAUT, EA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1985, 3 (04) :1295-1299
[3]   ORIGIN AND REDUCTION OF INTERFACIAL BORON SPIKES IN SILICON MOLECULAR-BEAM EPITAXY [J].
IYER, SS ;
DELAGE, SL ;
SCILLA, GJ .
APPLIED PHYSICS LETTERS, 1988, 52 (06) :486-488
[4]  
IYER SS, 1981, THESIS U CALIFORNIA
[5]  
IYER SS, 1986, EPITAXIAL SILICON TE
[6]   ALGAAS/GE/GAAS HETEROJUNCTION BIPOLAR-TRANSISTORS GROWN BY MOLECULAR-BEAM EPITAXY [J].
STRITE, S ;
UNLU, MS ;
ADOMI, K ;
GAO, GB ;
MORKOC, H .
IEEE ELECTRON DEVICE LETTERS, 1990, 11 (05) :233-235