Experimental and computational simulation studies on creep deformation mechanisms of a novel nanostructured Cu and Cu-10%Sn Alloy

被引:0
作者
Abo-Elsoud, Mohamed A. [1 ,2 ]
机构
[1] Beni Suief Univ, Dept Phys, Fac Sci, Cairo, Egypt
[2] Umm Al Qura Univ, Al Qunfudah Ctr Sci Res QCSR, Dept Phys, Univ,Coll Al Qunfudah, Mecca, Saudi Arabia
关键词
Cu (and alloys); mechanical alloying; creep; deformation mechanisms; computational simulation;
D O I
10.1142/S2047684115500086
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This work presents experimental and computational simulation studies on creep deformation mechanisms of a novel nanostructured Cu and Cu-10% Sn alloy that prepared by mechanical alloying (MA) copper with elemental Tin. Mechanical Newtonian creep model is employed for computational simulation of creep deformation mechanism under low stress-high temperature and to justify the experimental findings The observed behaviors are discussed and compared with the predications of the Nabarro-Herring (N-H) theory of directional diffusion. A simple theory based on the climb controlled generation of dislocations from a fixed density of sources is developed to explain the observed behavior. TEM and SEM investigations are convenient and powerful techniques for characterization of phases and a novel nano-grain structured of the resulting materials. The reduction of grain size to the nanometer scale improves their mechanical properties.
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页数:14
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