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- [11] Characteristics of secondary etching of SiO2 by ions reflected from a primary SiO2 target in a CHF3 plasma JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (02): : 404 - 410
- [13] Critical properties of CO2, CHF3, SF6, (CO2+CHF3), and (CHF3+SF6) JOURNAL OF CHEMICAL THERMODYNAMICS, 1998, 30 (04): : 481 - 496
- [17] SF6/O2 plasma for ICP/RIE SiC Etching 2024 38TH SYMPOSIUM ON MICROELECTRONICS TECHNOLOGY AND DEVICES, SBMICRO 2024, 2024,
- [18] Reactive Ion Etching of Germanium Using SF6/CHF3/He gas mixture 2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012), 2012, : 67 - 69
- [19] SIO2/SI ETCHING WITH CHF3 IN A HIGH-FIELD MAGNETRON JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1992, 10 (04): : 1227 - 1231
- [20] Selective SiO2/Al2O3 etching in CF4 and SF6 high-density plasma PROCEEDINGS OF THE ELEVENTH INTERNATIONAL SYMPOSIUM ON PLASMA PROCESSING, 1996, 96 (12): : 480 - 491