DC CONDUCTION MECHANISMS IN THIN POLYIMIDE FILMS

被引:21
作者
NEVIN, JH
SUMME, GL
机构
来源
MICROELECTRONICS AND RELIABILITY | 1981年 / 21卷 / 05期
关键词
D O I
10.1016/0026-2714(81)90061-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:699 / 705
页数:7
相关论文
共 11 条
[1]   STRUCTURAL DEPENDENCE OF ELECTRICAL CONDUCTIVITY OF POLYETHYLENE TEREPHTHALATE [J].
AMBORSKI, LE .
JOURNAL OF POLYMER SCIENCE, 1962, 62 (174) :331-&
[2]   MOBILITY AND CONDUCTIVITY OF IONS IN AND INTO POLYMERIC SOLIDS [J].
BARKER, RE .
PURE AND APPLIED CHEMISTRY, 1976, 46 (2-4) :157-170
[3]   UNIFORMITY OF THIN-FILMS - NEW TECHNIQUE APPLIED TO POLYIMIDES [J].
GIVENS, FL ;
DAUGHTON, WJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (02) :269-272
[4]   ELECTRON TRANSPORT MECHANISMS IN THIN INSULATING FILMS [J].
MEAD, CA .
PHYSICAL REVIEW, 1962, 128 (05) :2088-&
[5]  
Muller L., 1970, Journal of Non-Crystalline Solids, V4, P504, DOI 10.1016/0022-3093(70)90085-2
[6]   DIELECTRIC PROPERTIES OF POLYIMIDE FILM .2. DC PROPERTIES [J].
SACHER, E .
IEEE TRANSACTIONS ON ELECTRICAL INSULATION, 1979, 14 (02) :85-93
[7]   NEW TRANSISTOR WITH 2-LEVEL METAL-ELECTRODES [J].
SAIKI, A ;
HARADA, S ;
OKUBO, T ;
MUKAI, K ;
KIMURA, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (10) :1619-1622
[8]   NOVEL PLANAR MULTILEVEL INTERCONNECTION TECHNOLOGY UTILIZING POLYIMIDE [J].
SATO, K ;
HARADA, S ;
SAIKI, A ;
KIMURA, T ;
OKUBO, T ;
MUKAI, K .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (03) :176-180
[9]   ELECTRICAL-CONDUCTION OF POLYPYROMELLITIMIDE FILMS AT TEMPERATURES OF 120-DEGREES-C-180-DEGREES-C [J].
SAWA, G ;
NAKAMURA, S ;
IIDA, K ;
IEDA, M .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1980, 19 (03) :453-458
[10]  
SHAH P, 1979, 1979 P INT C EL DISC, P465