CURING KINETICS OF EPOXY-RESINS BASED ON BISPHENOL-S AND ITS DERIVATIVES

被引：23

作者：

LIAW, DJ

SHEN, WC

机构：

[1] Department of Chemical Engineering, National Taiwan Institute of Technology, Taipei

来源：

ANGEWANDTE MAKROMOLEKULARE CHEMIE | 1992年 / 200卷

关键词：

D O I：

10.1002/apmc.1992.052000111

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

The curing reactions of several epoxy resins based on bisphenol-S with amine have been investigated by differential scanning calorimetry. The overall kinetic parameters of the curing reactions, such as activation energy, curing range and the order of the reaction are estimated by using four computational methods based on a single dynamic scan over the temperature range 50-300-degrees-C. Epoxy resins containing oxyethylene or oxypropylene units have lower reaction order and activation energy than the diglycidylether of bisphenol-S. This indicates that flexible epoxide resins are easier to cure.

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页码：137 / 146

页数：10

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