THE EFFECT OF ULTRASONIC FREQUENCY ON INTERMETALLIC REACTIVITY OF AU-AL BONDS

被引：0
|
作者：
RAMSEY, TH
ALFARO, C
机构：
来源：
SOLID STATE TECHNOLOGY | 1991年 / 34卷 / 12期
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：37 / 38
页数：2
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