METALLIZATION SYSTEMS FOR OHMIC CONTACTS TO P-TYPE AND N-TYPE GAAS

被引:10
作者
GUPTA, RP [1 ]
FREYER, J [1 ]
机构
[1] TECH UNIV MUNICH,LEHRSTUHL ALLGEMEINE ELEKTROTECH & ANGEW ELEKTR,D-8000 MUNICH 2,FED REP GER
关键词
D O I
10.1080/00207217908938663
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Various metallization systems to n- and p-type GaAs have been investigated. The fabrication of the ohmic contacts and the method of contact resistance measurements are described. For each metallization system investigated, there exists an optimum alloying cycle (i. e. alloying temperature and time) which gives minimum contact resistance.
引用
收藏
页码:459 / 467
页数:9
相关论文
共 26 条
[1]   CONTACT RESISTANCE AND CONTACT RESISTIVITY [J].
BERGER, HH .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (04) :507-&
[2]  
BERGER HH, 1969, IEEE INT SOL STAT CI, P160
[3]   METAL-SEMICONDUCTOR CONTACTS FOR GAAS BULK EFFECT DEVICES [J].
BRASLAU, N ;
GUNN, JB ;
STAPLES, JL .
SOLID-STATE ELECTRONICS, 1967, 10 (05) :381-+
[4]  
CHUNG YT, 1971, SOLID ST ELECTRON, V14, P433
[5]   OHMIC CONTACTS FOR GAAS DEVICES [J].
COX, RH ;
STRACK, H .
SOLID-STATE ELECTRONICS, 1967, 10 (12) :1213-+
[6]   SPECIFIC CONTACT RESISTANCE OF OHMIC CONTACTS TO GALLIUM-ARSENIDE [J].
EDWARDS, WD ;
TORRENS, AB ;
HARTMAN, WA .
SOLID-STATE ELECTRONICS, 1972, 15 (04) :387-&
[7]   OHMIC CONTACTS TO EPITAXIAL PGAAS [J].
GOPEN, HJ ;
YU, AYC .
SOLID-STATE ELECTRONICS, 1971, 14 (06) :515-&
[8]   ALLOYING BEHAVIOR OF AU AND AU-GE ON GAAS [J].
GYULAI, J ;
MAYER, JW ;
RODRIGUEZ, V ;
YU, AYC ;
GOPEN, HJ .
JOURNAL OF APPLIED PHYSICS, 1971, 42 (09) :3578-+
[9]   CONTROL OF SCHOTTKY-BARRIER HEIGHT BY THIN HIGH-DOPED LAYER [J].
HARIU, T ;
SHIBATA, Y .
PROCEEDINGS OF THE IEEE, 1975, 63 (10) :1523-1524
[10]   VERY LOW RESISTANCE NI-AUGE-NI CONTACTS TO N-GAAS [J].
HEIME, K ;
KONIG, U ;
KOHN, E ;
WORTMANN, A .
SOLID-STATE ELECTRONICS, 1974, 17 (08) :835-&