DEPOSITION OF TIN FILMS WITH TITANIUM INTERLAYER ON LOW-CARBON STEEL BY REACTIVE RF MAGNETRON SPUTTERING

TiN coatings with a titanium interlayer were deposited on low carbon steel by reactive r.f. magnetron sputtering. The preliminary titanium interlayer began to react with oxygen, carbon and nitrogen during sputtering as the substrate temperature was increased. The adhesive strength as estimated by the pull-off test was found to be raised when a titanium interlayer was present. The orientations of the deposited TiN films depended on the reactive gas flow rate and the substrate temperature. It appeared that a (111) TiN film could endure greater stress as a result of lattice misfit. It was also found that the film structure tended to be polycrystalline and consequently it is suggested that with such films the interfacial stress is lowered and so good adhesion can be achieved.