DIRECT FORMATION OF POLYIMIDE THIN-FILMS BY VAPOR-DEPOSITION POLYMERIZATION

被引：34

作者：

KUBONO, A ^{[1
]}

HIGUCHI, H ^{[1
]}

UMEMOTO, S ^{[1
]}

OKUI, N ^{[1
]}

机构：

[1] TOKYO INST TECHNOL,DEPT ORGAN & POLYMER MAT,MEGURO KU,TOKYO 152,JAPAN

来源：

THIN SOLID FILMS | 1993年 / 232卷 / 02期

关键词：

D O I：

10.1016/0040-6090(93)90018-K

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Polyamic acid films and polyimide films were prepared by vapor deposition polymerization at three substrate temperatures, 25-degrees-C, 125-degrees-C and 175-degrees-C. At substrate temperatures below 125-degrees-C, poly(amic acid) films were formed and those annealed above 125-degrees-C transformed to polyimide films. At substrate temperatures above 175-degrees-C, polyimide thin films were formed directly on the substrate. Wide-angle X-ray diffraction and IR spectra obtained using transmission and reflection-absorption (RAS) methods confirmed that the molecular chains in all films tended to align perpendicular to the substrate surface. The film prepared at 125-degrees-C had greater molecular orientation perpendicular to the substrate than those prepared at 25-degrees-C. The polyimide film prepared at a high substrate temperature exhibited greater thermal stability than those prepared at a low substrate temperature.

引用

页码：256 / 260

页数：5

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