HEAT-STRESS RESISTANCE OF HOT-MELT ADHESIVES

Elevated-temperature stress resistance can be an important consideration when selecting and troubleshooting adhesives Peel strength, shear strength, and softening point often are used as indicators of heat-stress resistance, but they can be very misleading. This paper presents an overview of a test method, developed by the Adhesion Committee of the Institute of Packaging Professionals, that compares heat-stress properties of hot-melt adhesives. It also includes a discussion on bow selected variables affect the elevated-temperature stress resistance of bot-melt adhesives and examples showing how adhesive viscosity and softening point can be misleading indicators of elevated-temperature bond strength.