SOLVENT-FREE LAMINATING WITH ONE-COMPONENT AND 2-COMPONENT ADHESIVES

被引：0
|
作者：
KUPFER, GAH
机构：
来源：
VERPACKUNGS RUNDSCHAU | 1980年 / 31卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TS2 [食品工业];
学科分类号：
0832 ;
摘要：
引用
收藏
页码：432 / &
相关论文
共 50 条
  • [1] ONE-COMPONENT ADHESIVES FOR LAMINATING VERSATILITY
    DAMSKE, LA
    ADHESIVES AGE, 1970, 13 (10): : 34 - &
  • [2] Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives
    Jee, Sung Min
    Ahn, Cheol-Hee
    Park, Jong Hyuk
    Kim, Tae Ann
    Park, Min
    COMPOSITES PART B-ENGINEERING, 2020, 202 (202)
  • [3] UNIVERSAL ONE-COMPONENT AND 2-COMPONENT INTERFACING TECHNIQUES
    PERERA, TB
    BEHAVIOR RESEARCH METHODS & INSTRUMENTATION, 1980, 12 (02): : 236 - 237
  • [4] THE THERMODYNAMICS OF ONE-COMPONENT AND 2-COMPONENT ELASTIC SYSTEMS
    KATZ, SM
    TEXTILE RESEARCH JOURNAL, 1950, 20 (01) : 16 - 21
  • [5] SOLIDIFICATION MECHANISMS IN ONE-COMPONENT AND 2-COMPONENT METALLIC MELTS
    CHISTYAKOV, YD
    BAIKOV, YA
    AKULENOK, MV
    RUSSIAN METALLURGY, 1988, (05): : 61 - 68
  • [6] INTERACTION OF ONE-COMPONENT AND 2-COMPONENT PLASMA WITH OPTICAL PHONONS
    BRON, WE
    SMITH, GO
    JUHASZ, T
    MEHTA, S
    LEVINSON, YB
    KUHL, J
    KLINGENSTEIN, M
    JOURNAL OF LUMINESCENCE, 1992, 53 (1-6) : 283 - 287
  • [7] ONE-COMPONENT AND 2-COMPONENT SATURATION OF CAST IRONS WITH SILICON AND CHROMIUM
    KRAEVOI, VI
    METAL SCIENCE AND HEAT TREATMENT, 1988, 30 (3-4) : 278 - 283
  • [8] Electronic Component Protection using solvent-free, one component polyurethanes
    Cuminetti, Nicola
    Lienert, Klaus W.
    2009 IEEE ELECTRICAL INSULATION CONFERENCE, 2009, : 297 - 300
  • [9] UV PHOTOELECTRON-SPECTROSCOPY OF SEVERAL ONE-COMPONENT AND 2-COMPONENT ORGANIC PHOTOCONDUCTORS
    KARL, N
    SATO, N
    SEKI, K
    INOKUCHI, H
    JOURNAL OF CHEMICAL PHYSICS, 1982, 77 (10): : 4870 - 4878
  • [10] One-component silicon adhesives-sealants
    R. M. Minas’yan
    Polymer Science. Series D, 2008, 1 (4) : 286 - 288
12345