ELECTROMIGRATION IN THIN GOLD FILMS

被引：39

作者：

KLEIN, BJ ^{[1
]}

机构：

[1] CNRS,LAB PHYS MAT,BELLEVUE 92,FRANCE

来源：

JOURNAL OF PHYSICS F-METAL PHYSICS | 1973年 / 3卷 / 04期

关键词：

D O I：

10.1088/0305-4608/3/4/010

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：691 / &

共 11 条

[1] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J].

ATTARDO, MJ ;

ROSENBERG, R .

JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) :2381-+

[2] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J].

BERENBAUM, L ;

ROSENBERG, R .

THIN SOLID FILMS, 1969, 4 (03) :187-+

[3] ELECTROMIGRATION-INDUCED FAILURES IN, AND MICROSTRUCTURE AND RESISTIVITY OF, SPUTTERED GOLD FILMS [J].

BLAIR, JC ;

GHATE, PB ;

FULLER, CR ;

HAYWOOD, CT .

JOURNAL OF APPLIED PHYSICS, 1972, 43 (02) :307-&

[4] ELECTROMIGRATION IN THIN AL FILMS [J].

BLECH, IA ;

MEIERAN, ES .

JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) :485-&

[5]

CARSLAW HS, 1959, CONDUCTION HEAT SOLI

[6]

HARTMAN TE, 1969, IEEE T ELECTRON DEVI, VDE16, P407

[7] DIRECTION OF ELECTROMIGRATION IN THIN SILVER, GOLD, AND COPPER FILMS [J].

HUMMEL, RE ;

BREITLING, RM .

APPLIED PHYSICS LETTERS, 1971, 18 (09) :373-+

[8] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J].

HUNTINGTON, HB ;

GRONE, AR .

JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) :76-87

[9] INFLUENCE OF OXYGEN ON ADHERENCE OF GOLD FILMS TO OXIDE SUBSTRATES [J].

MATTOX, DM .

JOURNAL OF APPLIED PHYSICS, 1966, 37 (09) :3613-&

[10] RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS [J].

ROSENBERG, R ;

BERENBAUM, L .

APPLIED PHYSICS LETTERS, 1968, 12 (05) :201-+

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