ULTRA-LOW DIELECTRIC-CONSTANT POROUS SILICA THICK-FILMS FOR HIGH-SPEED IC PACKAGING

被引：3
|
作者：
MOHIDEEN, U [1 ]
GURURAJA, TR [1 ]
CROSS, LE [1 ]
ROY, R [1 ]
机构：
[1] PENN STATE UNIV,MAT RES LAB,UNIVERSITY PK,PA 16802
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1988年 / 11卷 / 01期
关键词：
D O I：
10.1109/33.2980
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：159 / 162
页数：4
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