EFFECT OF DEUTERON BOMBARDMENT ON THE ELECTRICAL RESISTIVITY OF COPPER, SILVER, AND GOLD

被引:0
|
作者
MARX, J
KOEHLER, J
WERT, C
机构
来源
PHYSICAL REVIEW | 1952年 / 86卷 / 04期
关键词
D O I
暂无
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
引用
收藏
页码:643 / 643
页数:1
相关论文
共 50 条
  • [41] EFFECT OF SINTERING CONDITIONS ON ELECTRICAL RESISTIVITY OF PRINTED SILVER INKS
    Xu, Hua
    Lo, Jeffery C. C.
    Qiu, Xing
    Cheng, Yuanjie
    Tao, Mian
    Lee, S. W. Ricky
    Ko, Lawrence C. L.
    Yeung, Ho Ki
    Yau, Chun Ho
    PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023, 2023,
  • [42] Electrical properties of deuteron irradiated high resistivity silicon
    Krupka, Jerzy
    Karcz, Waldemar
    Avdeyev, Sergej P.
    Kaminski, Pawel
    Kozlowski, Roman
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2014, 325 : 107 - 114
  • [43] Water-adsorption effect on electrical resistivity of nanoporous gold
    Hakamada, Masataka
    Kato, Naoki
    Miyazawa, Naoki
    Mabuchi, Mamoru
    SCRIPTA MATERIALIA, 2016, 123 : 30 - 33
  • [44] COPPER SILVER AND GOLD
    KING, RB
    ORGANOMETALLIC CHEMISTRY REVIEWS SECTION B-ANNUAL SURVEYS, 1968, 4 (01): : 155 - &
  • [45] Effect of different copper fillers on the electrical resistivity of conductive adhesives
    Ho, Li-Ngee
    Nishikawa, Hiroshi
    Takemoto, Tadashi
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (05) : 538 - 544
  • [46] EFFECT OF THERMAL TREATMENT ON ELECTRICAL RESISTIVITY OF COPPER PHOSPHATE GLASS
    DOZIER, AW
    WILSON, LK
    KINSER, DL
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1973, 18 (02): : 262 - 262
  • [47] EFFECT OF GRAIN BOUNDARIES ON ELECTRICAL RESISTIVITY OF POLYCRYSTALLINE COPPER AND ALUMINIUM
    ANDREWS, PV
    WEST, MB
    ROBESON, CR
    PHILOSOPHICAL MAGAZINE, 1969, 19 (161): : 887 - &
  • [48] Effect of different copper fillers on the electrical resistivity of conductive adhesives
    Li-Ngee Ho
    Hiroshi Nishikawa
    Tadashi Takemoto
    Journal of Materials Science: Materials in Electronics, 2011, 22 : 538 - 544
  • [49] EFFECT OF TEMPERATURE ON PHOTOELECTRIC ACTIVITY OF GOLD SILVER AND COPPER
    GIRAUD, G
    COMPTES RENDUS HEBDOMADAIRES DES SEANCES DE L ACADEMIE DES SCIENCES SERIE B, 1968, 266 (17): : 1121 - &
  • [50] Effect of silver on the gold-copper superlattice, AuCu
    Hultgren, R
    Tarnopol, L
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1939, 133 : 228 - 238