MACHINING OF SUBMICRON HOLES USING A FEMTOSECOND LASER AT 800-NM

被引：415

作者：

PRONKO, PP

DUTTA, SK

SQUIER, J

RUDD, JV

DU, D

MOUROU, G

机构：

[1] Center for Ultrafast Optical Science, University of Michigan, Ann Arbor, MI 48109-2099

来源：

OPTICS COMMUNICATIONS | 1995年 / 114卷 / 1-2期

关键词：

D O I：

10.1016/0030-4018(94)00585-I

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

The ability to machine very small features in materials has a number of technological applications. We have ablated holes, by laser ablation, into a metal film. Using 200 fs, 800 nm pulses from a Ti:sapphire laser, focused to a spot size of 3000 nm, we have produced holes with a diameter of 300 nm and a depth of 52 nm. The production of these small features is possible because the effects of thermal diffusion are minimized with the short pulses.

引用

页码：106 / 110

页数：5

共 5 条

[1]

BLOEMBERGEN N, 1985, MATER RES SOC S P, V51, P3

[2] LASER-INDUCED BREAKDOWN BY IMPACT IONIZATION IN SIO2 WITH PULSE WIDTHS FROM 7 NS TO 150 FS [J].