SELF-DIFFUSION IN COPPER AT LOW-TEMPERATURES

被引：20

作者：

LAM, NQ ^{[1
]}

ROTHMAN, SJ ^{[1
]}

NOWICKI, LJ ^{[1
]}

机构：

[1] ARGONNE NATL LAB,MAT SCI DIV,ARGONNE,IL 60439

来源：

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 1974年 / 23卷 / 01期

关键词：

D O I：

10.1002/pssa.2210230148

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：K35 / K38

页数：4

共 13 条

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[4] ELECTROCHEMICAL TECHNIQUE FOR MICROSECTIONING COPPER [J].

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[5]

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[6]

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[7] SELF-DIFFUSION IN COPPER BETWEEN 359 AND 632 DEGREES C [J].

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SCHULE, W .

PHYSICS LETTERS A, 1973, A 44 (07) :539-540

[8] INTERPRETATION OF SELF-DIFFUSION AND VACANCY PROPERTIES IN COPPER [J].

MEHRER, H ;

SEEGER, A .

PHYSICA STATUS SOLIDI, 1969, 35 (01) :313-&

[9] SUBMICRON SECTIONING TECHNIQUE FOR ANALYZING DIFFUSION SPECIMENS OF TANTALUM + NIOBIUM [J].

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[10]

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