DEPOSITION OF NOBLE METAL CONTACTS ON YBA(2)CU(3)O(7-X) THIN FILMS

被引：6

作者：

Hahn, R. ^{[1
]}

Schaeffter, T. ^{[1
]}

Klockau, J. ^{[1
]}

Fotheringham, G. ^{[1
]}

机构：

[1] Tech Univ Berlin, Gustav Meyer Allee 25,TIB 4-2-1, D-1000 Berlin 65, Germany

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 1993年 / 3卷 / 01期

关键词：

D O I：

10.1109/77.234029

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Ohmic contacts with low specific contact resistivities between YBa2Cu3O7-X thin films and noble metals have been fabricated using ion beam sputter etching and RF-Plasma contact preparation. The influence of deposition parameters has been investigated. Specific contact resistivities in the 10(-8) Omega cm(2) range at 77 K have been achieved and were evaluated using Cross Bridge Kelvin test structures with varying sizes between 5 and 50 mu m. The failure rate of wires bonded onto HTSC-Au/Ag pads was unacceptable in most cases. Substantial improvements have been achieved with Cr/Ti adhesion sublayers. Deposition parameters for optimum pull test results on MgO and LaAlO3 substrates are presented.

引用

页码：2979 / 2982

页数：4

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