CHARACTERIZATION OF EUTECTIC SN-BI SOLDER JOINTS

被引：277

作者：

MEI, Z ^{[1
]}

MORRIS, JW ^{[1
]}

机构：

[1] UNIV CALIF BERKELEY,DEPT MAT SCI & MINERAL ENGN,BERKELEY,CA 94720

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1992年 / 21卷 / 06期

关键词：

LOW TEMPERATURE SOLDERS; BISMUTH-TIN SOLDER;

D O I：

10.1007/BF02655427

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This report presents experimental results on 58Bi-42Sn solder joints, optical and SEM microstructures of their matrix and of their interface with copper, solidification behavior studied by differential scanning calorimetry, wettability to copper, creep, and low cycle fatigue. These results are discussed in comparison with 60Sn-40Pb solder, and with three low temperature solders, 52In-48Sn, 43Sn-43Pb-14Bi, and 40In-40Sn-20Pb. The 58Bi-42Sn solder paste with RMA flux wets Cu matrix with a wetting angle of 35-degrees and had a 15-degrees-C undercooling during solidification. The constitutive equation of the steady state shear strain rate, and the Coffin-Manson relation constants for the low cycle shear fatigue life at 65-degrees-C have been determined. The test results show that this solder has the best creep resistance but the poorest fatigue strength compared with the other four solders.

引用

页码：599 / 607

页数：9