REAL-TIME DETERMINATION OF THE DIRECTION OF WAFER TEMPERATURE-CHANGE BY SPATIALLY-RESOLVED INFRARED-LASER INTERFEROMETRIC THERMOMETRY

被引:13
作者
DONNELLY, VM
机构
[1] AT&T Bell Laboratories, Murray Hill
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1993年 / 11卷 / 05期
关键词
D O I
10.1116/1.578583
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Interferometric thermometry is a noncontact method of directly measuring the temperature of a semiconductor wafer. Periodic modulation in the intensity of reflected laser light is detected as the temperature-dependent change in the optical pathlength causes transitions from constructive to destructive interference between the front and back surfaces of the wafer. In its simplest implementation, only a temperature change is detected; heating and cooling are indistinguishable. In this article, a simple method for determining the direction of temperature change is described and demonstrated, based on sensing phase differences in periodic signal intensity detected from two regions of slightly different thickness. A statistical analysis reveals that this method will have an extremely high probability of correctly determining the direction of temperature change in almost all instances.
引用
收藏
页码:2393 / 2397
页数:5
相关论文
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