SURVEY OF CORROSION FAILURE MECHANISMS IN MICROELECTRONIC DEVICES

被引：0
|
作者：
SCHNABLE, GL
COMIZZOLI, RB
KERN, W
WHITE, LK
机构：
来源：
RCA REVIEW | 1979年 / 40卷 / 04期
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：416 / 445
页数：30
相关论文
共 50 条
  • [21] Metallography of microelectronic devices
    Ahmed, WU
    PRAKTISCHE METALLOGRAPHIE-PRACTICAL METALLOGRAPHY, 2002, 39 (08): : 437 - 448
  • [22] PACKAGING OF MICROELECTRONIC DEVICES
    MANZIONE, LT
    PLASTICS ENGINEERING, 1983, 39 (03) : 34 - 34
  • [23] Vacuum microelectronic devices
    Spindt, CA
    Schwoebel, R
    Brodie, I
    CYRIL HILSUM SYMPOSIUM - FUNCTIONAL MATERIALS IN NEW MILLENNIUM SYSTEMS - FROM SCIENCE INTO APPLICATIONS, 1997, : 139 - 179
  • [24] INVESTIGATION OF THE MOLECULAR PROCESSES CONTROLLING CORROSION FAILURE MECHANISMS IN PLASTIC ENCAPSULATED SEMICONDUCTOR-DEVICES
    LUM, RM
    FEINSTEIN, LG
    MICROELECTRONICS AND RELIABILITY, 1981, 21 (01): : 15 - 31
  • [25] Scanning Auger microscopy study of electromigration induced failure in submicrometric microelectronic devices
    Santucci, S
    Lozzi, L
    Pacifico, D
    Alfonsetti, R
    Moccia, G
    APPLIED SURFACE SCIENCE, 1999, 144-45 : 329 - 333
  • [26] A STRESS-INDUCED DIFFUSION-MODEL FOR FAILURE OF INTERCONNECTS IN MICROELECTRONIC DEVICES
    GUO, Q
    WHITMAN, CS
    KEER, LM
    CHUNG, YW
    JOURNAL OF APPLIED PHYSICS, 1991, 69 (11) : 7572 - 7580
  • [27] Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices
    Chen, Yuan
    Zhang, Xiaowen
    INFORMATION TECHNOLOGY FOR MANUFACTURING SYSTEMS II, PTS 1-3, 2011, 58-60 : 2171 - +
  • [28] Failure analysis method to study solder wicking phenomena in modern microelectronic devices
    Vargas, Lidia
    Terrazas, Juan
    Cabrera, Eduardo
    Valdez, Benjamin
    Nedev, Nicola
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (02) : 609 - 617
  • [29] Failure analysis method to study solder wicking phenomena in modern microelectronic devices
    Lidia Vargas
    Juan Terrazas
    Eduardo Cabrera
    Benjamin Valdez
    Nicola Nedev
    Journal of Materials Science: Materials in Electronics, 2014, 25 : 609 - 617
  • [30] Recognition and analysis of corrosion failure mechanisms
    Suess, Steven J.
    3rd International Conference on Computing, Communications and Control Technologies, Vol 3, Proceedings, 2005, : 206 - 212
12345