THERMAL AND INFRARED METHODS FOR NONDESTRUCTIVE TESTING OF ADHESIVE-BONDED STRUCTURES

被引：0

作者：

KUTZCHER, EW

ZIMMERMANN, KH

BOTKIN, JL

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中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

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页码：143 / +

页数：1

共 8 条

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[4] BYLER WH, 1961, MATER EVAL, V19, P177
[5] THERMAL SURFACE IMPEDANCE FOR PLANE HEAT WAVES IN LAYERED MATERIALS
GREEN, DR
[J]. JOURNAL OF APPLIED PHYSICS, 1966, 37 (08) : 3095 - &
[6] SACHS HL, 1961, 6515 ARG NAT LAB REP
[7] Swann R. T., 1961, D714 NASA TN
[8] WOODMANSEE WE, 1966, MATER EVAL, V24, P564