ELECTRODEPOSITION OF COPPER ON FILM-COVERED METAL-SURFACES

The electrodeposition of copper from copper refinery electrolyte at 58°C onto various film-covered substrates such as emulsion-coated copper, copper covered with benzothiazolethiol (BTAT), black anodized titanium, conditioned titanium and cold rolled vacuum annealed titanium, has been investigated by electrochemical techniques and by scanning electron microscopy. The nucleation and growth behaviour of the copper electrodeposits on the various substrates are governed by the respective charge-transfer rates. The deposition potentials are used to predict the charge-transfer rates at the film-covered electrodes. The BTAT-coated copper gave a dense uniform deposit free from laciness. Problems associated with other parting agents, viz. emulsion film on copper and oxide film on titanium, are discussed. Suggestions are made for improving the quality of the deposit on these substrates. © 1979.