METALLIZATION IN MICROELECTRONICS

被引:61
作者
GHATE, PB [1 ]
BLAIR, JC [1 ]
FULLER, CR [1 ]
机构
[1] TEXAS INSTRUMENTS INC, SEMICOND RES & ENGN LABS, DALLAS, TX 75222 USA
关键词
D O I
10.1016/0040-6090(77)90205-X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:69 / 84
页数:16
相关论文
共 42 条
[1]  
ANGELUCCI T, 1976, SOLID STATE TECHNOL, V19, P21
[2]   FABRICATION OF SILICON MOS DEVICES USING X-RAY LITHOGRAPHY [J].
BERNACKI, SE ;
SMITH, HI .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, ED22 (07) :421-428
[3]   ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS [J].
BLACK, JR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) :338-&
[4]   ELECTROMIGRATION-INDUCED FAILURES IN, AND MICROSTRUCTURE AND RESISTIVITY OF, SPUTTERED GOLD FILMS [J].
BLAIR, JC ;
GHATE, PB ;
FULLER, CR ;
HAYWOOD, CT .
JOURNAL OF APPLIED PHYSICS, 1972, 43 (02) :307-&
[5]   ELECTROMIGRATION-INDUCED FAILURES IN ALUMINUM FILM CONDUCTORS [J].
BLAIR, JC ;
GHATE, PB ;
HAYWOOD, CT .
APPLIED PHYSICS LETTERS, 1970, 17 (07) :281-&
[6]   EFFECT OF VACUUM AMBIENCE ON AL-SI CONTACTS [J].
BLAIR, JC ;
GHATE, PB .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01) :79-84
[7]  
BLAIR JC, 1971, WESCON5 TECH PAP
[8]   EFFECT OF OXIDIZING AMBIENTS ON PLATINUM SILICIDE FORMATION .2. AUGER AND BACKSCATTERING ANALYSES [J].
BLATTNER, RJ ;
EVANS, CA ;
LAU, SS ;
MAYER, JW ;
ULLRICH, BM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (12) :1732-1736
[9]   EVAPORATED FILM PROFILES OVER STEPS IN SUBSTRATES [J].
BLECH, IA .
THIN SOLID FILMS, 1970, 6 (02) :113-&
[10]  
BLECH JA, 1970, 8TH P ANN S REL PHYS, P243