DIE BOND MATERIALS AND BONDING MECHANISMS IN MICROELECTRONIC PACKAGING

被引：10

作者：

SELVADURAY, GS

机构：

[1] San Jose State Univ, San Jose, CA,, USA, San Jose State Univ, San Jose, CA, USA

来源：

THIN SOLID FILMS | 1987年 / 153卷

关键词：

BONDING - Materials - GLASS - SILVER AND ALLOYS;

D O I：

10.1016/0040-6090(87)90203-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The bonding mechanism for a silver-lead borate glass adhesive, used as a die bonding material in microelectronics packaging, was investigated. Silicon dies were bonded to alumina substrates with the glass adhesive, thermally cured and then sectioned, polished and analyzed. The diffusion of silicon from the die was found to be impotant in the development of the bond. Adhesion between the silver glass and the silicon die was found to be achieved via a glass network structure that starts at the silicon dioxide film on the die back side. Bonding between silver glass and the ceramic substrate was found to be mechanical in nature.

引用

页码：431 / 445

页数：15