EFFECT OF FILLERS ON THE ADHESION OF COPPER TO POLYVINYL-CHLORIDE

被引：1

作者：

CHUANG, PY

WAN, CC

CHEH, HY

机构：

[1] Department of Industrial Chemistry, National Tsing Hua University, Hsinchu

[2] Department of Chemical Engineering and Applied Chemistry, Columbia University, New York

来源：

SURFACE TECHNOLOGY | 1979年 / 8卷 / 05期

关键词：

D O I：

10.1016/0376-4583(79)90006-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The inability to roughen the surfaces of polyvinyl chloride (PVC) materials effectively is responsible for the poor adhesion between PVC and electrolessly deposited copper. It was found that the adhesion of copper to a PVC surface was greatly enhanced when a suitable filler material was impregnated into the polymer and later extracted. It was also observed that the adhesion between copper and plastics could be further improved by a post-treatment aging step. The optimum process conditions for achieving good adhesion are reported. © 1979.

引用

页码：429 / 439

页数：11

共 15 条

[1]

Mueller, Baudrand, Plating on Plastics, (1971)

[2]

Innes, Electroplat. Met. Finish., 22, 5, (1969)

[3]

Jpn. Patent 69-7129, (1969)

[4]

Jpn. Patent 71-35517, (1971)

[5]

U.S. Patent 3,716,394, (1973)

[6]

Nakamura, Mori, Sugimoto, Journal of Applied Polymer Science, 16, (1972)

[7]

Kadreva, Georgieva, Lazarova, Electroplat. Met. Finish., 28, 3, (1975)

[8]

Elmore, Davis, Journal of The Electrochemical Society, 116, (1969)

[9]

Beacom, Wedel, J. Colloid Interface Sci., 34, (1970)

[10]

Kato, Polymer, 8, (1967)

← 1 2 →