CONFERENCE ON CHEMICAL-MECHANICAL ENGINEERING

被引：0
|
作者：
MINAEV, GA
机构：
来源：
KHIMICHESKAYA PROMYSHLENNOST | 1980年 / 08期
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
引用
收藏
页码：505 / 506
页数：2
相关论文
共 50 条
  • [1] CHEMICAL-MECHANICAL POLISHING OF SILICON
    BLAKE, LH
    MENDEL, E
    SOLID STATE TECHNOLOGY, 1970, 13 (01) : 42 - &
  • [2] CHEMICAL-MECHANICAL MOLECULAR LASER
    BIRYUKOV, AS
    SHELEPIN, LA
    SOVIET PHYSICS TECHNICAL PHYSICS-USSR, 1971, 15 (12): : 2018 - &
  • [3] Advances in chemical-mechanical planarization
    Singh, RK
    Bajaj, R
    MRS BULLETIN, 2002, 27 (10) : 743 - 751
  • [4] Advances in Chemical-Mechanical Planarization
    Rajiv K. Singh
    Rajeev Bajaj
    MRS Bulletin, 2002, 27 : 743 - 751
  • [5] Chemical boundary lubrication in chemical-mechanical planarization
    Liang, H
    TRIBOLOGY INTERNATIONAL, 2005, 38 (03) : 235 - 242
  • [6] A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale
    Bai, J.
    Zhao, Y. W.
    Wang, Y. G.
    APPLIED SURFACE SCIENCE, 2007, 253 (20) : 8489 - 8494
  • [7] CHEMICAL PROCESSES IN THE CHEMICAL-MECHANICAL POLISHING OF COPPER
    STEIGERWALD, JM
    MURARKA, SP
    GUTMANN, RJ
    DUQUETTE, DJ
    MATERIALS CHEMISTRY AND PHYSICS, 1995, 41 (03) : 217 - 228
  • [8] Chemical-mechanical planarization advances with the times
    University of Central Florida, Orlando
    不详
    不详
    IEEE Potentials, 2008, 1 (26-30): : 26 - 30
  • [9] TRIBOLOGY ANALYSIS OF CHEMICAL-MECHANICAL POLISHING
    RUNNELS, SR
    EYMAN, LM
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1994, 141 (06) : 1699 - 1701
  • [10] CHAMPS (CHemicAl-Mechanical Planarization Simulator)
    Kim, YH
    Yoo, KJ
    Kim, KH
    Yoon, BY
    Park, YK
    Ha, SR
    Kong, JT
    2000 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, 2000, : 123 - 126
12345