A NOVEL METHOD FOR MEASURING THE THERMAL-CONDUCTIVITY OF SUBMICROMETER THICK DIELECTRIC FILMS

被引:37
作者
OKUDA, M
OHKUBO, S
机构
[1] Functional Devices Research Laboratories, NEC Corporation, Miyamae-ku, Kawasaki, Kanagawa, 216
关键词
D O I
10.1016/0040-6090(92)90280-O
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this article we describe a new technique for measuring the thermal conductivity of dielectric films a few hundred nanometres thick supported by substrates. The method utilizes a 0.6-mu-m wide, 500-mu-m long metal line for-med on the surface of the film to be tested. The metal line serves as a heat source and as a sensor of its own temperature increase. Measurement is made in about 1-mu-s and this completely eliminates any possible substrate effects on the conductivity results. The feasibility of the method has been initially confirmed by measurements made on bulk fused quartz. Silicon dioxide (SiO2) films (0.1-1-mu-m thick), produced on silicon substrates by thermal oxidation, have thermal conductivities between 1.35 and 1.55 W m-1 K-1, which is almost identical to that of bulk fused quartz. The accuracy of these measurements is estimated to be better than +/- 10%.
引用
收藏
页码:176 / 181
页数:6
相关论文
共 14 条
[1]  
AKABORI M, 1990, 11TH P JPN S THEM PR, P17
[2]   THERMAL-CONDUCTIVITY OF THIN-FILMS - MEASUREMENTS AND UNDERSTANDING [J].
CAHILL, DG ;
FISCHER, HE ;
KLITSNER, T ;
SWARTZ, ET ;
POHL, RO .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (03) :1259-1266
[3]  
ESPE W, 1962, WERKSTOFFKUNDE HOCHV, V2
[4]   SHORT-TIME-SCALE MEASUREMENT OF LOW-TEMPERATURE SPECIFIC-HEAT OF POLYMETHYL METHACRYLATE AND FUSED SILICA [J].
GOUBAU, WM ;
TAIT, RA .
PHYSICAL REVIEW LETTERS, 1975, 34 (19) :1220-1223
[5]   TRANSIENT HOT-STRIP METHOD FOR SIMULTANEOUSLY MEASURING THERMAL-CONDUCTIVITY AND THERMAL-DIFFUSIVITY OF SOLIDS AND FLUIDS [J].
GUSTAFSSON, SE ;
KARAWACKI, E ;
KHAN, MN .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1979, 12 (09) :1411-1421
[6]   THERMAL-PROPERTIES OF THIN INSULATING LAYERS USING PULSE TRANSIENT HOT STRIP MEASUREMENTS [J].
GUSTAFSSON, SE ;
CHOHAN, MA ;
AHMED, K ;
MAQSOOD, A .
JOURNAL OF APPLIED PHYSICS, 1984, 55 (09) :3348-3353
[7]   THERMAL-DIFFUSIVITY MEASUREMENT OF THIN-FILMS BY MEANS OF AN AC CALORIMETRIC METHOD [J].
HATTA, I ;
SASUGA, Y ;
KATO, R ;
MAESONO, A .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1985, 56 (08) :1643-1647
[8]   SIMULTANEOUS MEASUREMENT OF THE THERMAL-CONDUCTIVITY AND THE THERMAL-DIFFUSIVITY OF LIQUIDS BY THE TRANSIENT HOT-WIRE METHOD [J].
NAGASAKA, Y ;
NAGASHIMA, A .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1981, 52 (02) :229-232
[9]   TRANSIENT THERMOREFLECTANCE FROM THIN METAL-FILMS [J].
PADDOCK, CA ;
EESLEY, GL .
JOURNAL OF APPLIED PHYSICS, 1986, 60 (01) :285-290
[10]   THERMAL-ANALYSIS OF ELECTROMIGRATION TEST STRUCTURES [J].
SCHAFFT, HA .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1987, 34 (03) :664-672