JOINING OF SILICON-NITRIDE USING GLASS SOLDERS

被引：0
作者：
IWAMOTO, N
KAMAI, M
OHNISHI, K
INOUE, H
FUJII, K
UESAKA, SY
USUI, I
机构：
[1] SAGA PREFECTURAL GOVT,IND RES INST,SAGA 84001,JAPAN
[2] OSAKA UNIV,GRAD SCH,SUITA,OSAKA 565,JAPAN
来源：
ISIJ INTERNATIONAL | 1990年 / 30卷 / 12期
关键词：
SILICON NITRIDE; JOINING; GLASS SOLDER;
D O I：
10.2355/isijinternational.30.1119
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
It is well known that segregation of Ti and formation of TiN occurs when active brazing alloys such as Ag-Cu-Ti were used for Si3N4 joining. Si3N4-Si3N4 joining was carried out using several glass solders containing oxides of active metal, 1A group elements and 2A group elements without applying pressure. Si3N4-glass reaction and bonding behavior of these elements in Si3N4-Si3N4 joint were studied. The bonding strength obtained from Silicon nitride joints using glass solder in the system SiO2-Al2O3-Li2O was strong enough for practical application.
引用
收藏
页码：1119 / 1123
页数：5
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