PACKAGING TECHNOLOGY FOR A 10-GB/S PHOTORECEIVER MODULE

We designed a 10-Gb/s photoreceiver module integrating a flip-chip avalanche photodiode (APD), a Si-preamplifier IC, and a slant-ended fiber (SEF). Flip-chip bonding minimizes parasitic reactances in the interconnect between the photodiode and the preamplifier IC. The optical coupling system consists of a slant-ended fiber and a microlens monolithically fabricated on the photodiode. This gives a flat IC-package assembly, which enables stripline interfaces to extract high-speed signals, increases misalignment tolerances, and lowers package height. Tolerances of over +/- 9mum were obtained in every direction, which matched our theoretical predictions. To attach and hermetically seal the optical coupling, the fiber ferrule was directly laser-welded to the package wall with a double ring structure. The module withstood shock and vibration tests and had a 10-GHz bandwidth and -23-dBm minimum photosensitivity at 10 Gb/s.