TIN COATINGS ON MILD-STEEL SUBSTRATES WITH ELECTROLESS NICKEL AS AN INTERLAYER

被引：45

作者：

CHEN, YI

DUH, JG

机构：

[1] Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu

来源：

SURFACE & COATINGS TECHNOLOGY | 1991年 / 48卷 / 02期

关键词：

D O I：

10.1016/0257-8972(91)90140-R

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Electroless nickel deposits are incorporated as an interlayer between TiN coatings and mild steel substrates. The electroless nickel layer recrystallizes during r.f. sputtering and a coating assembly of TiN/Ni3/Fe is formed. The employment of electroless nickel results in an increase in the surface hardness as well as the adhesion strength. A Knoop surface hardness as high as 2120 HK5 (close to the hardness of bulk TiN) can be achieved in the interlayer-modified TiN coating.

引用

页码：163 / 168

页数：6

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