A COMPACT THERMAL NOISE MODEL FOR THE INVESTIGATION OF SOFT ERROR RATES IN MOS VLSI DIGITAL CIRCUITS

被引：10
|
作者：
LAYMAN, PA [1 ]
CHAMBERLAIN, SG [1 ]
机构：
[1] UNIV WATERLOO,DEPT ELECT ENGN,WATERLOO N2L 3G1,ONTARIO,CANADA
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1989年 / 24卷 / 01期
关键词：
D O I：
10.1109/4.16305
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：79 / 89
页数：11
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