STEAM CONDENSATION ON ELECTROPLATED GOLD - EFFECT OF PLATING THICKNESS

被引：48
作者：
WOODRUFF, DW
WESTWATER, JW
机构：
[1] Department of Chemical Engineering, University of Illinois., Urbana, IL
来源：
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 1979年 / 22卷 / 04期
基金：
美国国家科学基金会;
关键词：
D O I：
10.1016/0017-9310(79)90066-8
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：629 / 632
页数：4
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