ANALYSIS AND REALIZATION OF CASCADED TRANSMISSION-LINE NETWORKS IN TIME DOMAIN

被引：8

作者：

BOAKYE, KA ^{[1
]}

WING, O ^{[1
]}

机构：

[1] COLUMBIA UNIV,DEPT ELECT ENGN & COMP SCI,NEW YORK,NY 10027

来源：

IEEE TRANSACTIONS ON CIRCUIT THEORY | 1973年 / CT20卷 / 03期

关键词：

D O I：

10.1109/TCT.1973.1083672

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：301 / 307

页数：7

共 50 条

[1] ANALYSIS AND REALIZATION OF CASCADED TRANSMISSION-LINE NETWORKS BY THE TRANSFER SCATTERING MATRIX
KOMURO, T
AKIYAMA, M
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS, 1985, 32 (11): : 1166 - 1169
[2] TIME-DOMAIN REALIZABILITY CONDITIONS FOR CASCADED TRANSMISSION-LINE NETWORKS - COMMENT
PANG, KK
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS, 1975, 22 (08): : 708 - 709
[3] RECIPROCAL REALIZATION OF A CLASS OF 2-VARIABLE CASCADED TRANSMISSION-LINE NETWORKS
FUJIMOTO, H
INTERNATIONAL JOURNAL OF ELECTRONICS, 1995, 78 (06) : 1127 - 1138
[4] CASCADED NONCOMMENSURATE TRANSMISSION-LINE NETWORKS AS OPTIMIZATION PROBLEMS
BANDLER, JW
MACDONALD, PA
IEEE TRANSACTIONS ON CIRCUIT THEORY, 1969, CT16 (03): : 391 - +
[5] APPROXIMATION FOR RESPONSE OF CAPACITIVELY LOADED TRANSMISSION-LINE NETWORKS IN TIME DOMAIN
MURRAYSH.R
ELECTRONICS LETTERS, 1969, 5 (22) : 550 - &
[6] SYNTHESIS OF SOME CLASSES OF MULTIVARIABLE CASCADED TRANSMISSION-LINE NETWORKS
OZAKI, H
SHIRAKAW.I
TAKAHASH.H
ELECTRONICS & COMMUNICATIONS IN JAPAN, 1968, 51 (05): : 11 - &
[7] SYNTHESIS OF SOME CLASSES OF MULTIVARIABLE CASCADED TRANSMISSION-LINE NETWORKS
SHIRAKAWA, I
TAKAHASHI, H
OZAKI, H
IEEE TRANSACTIONS ON CIRCUIT THEORY, 1968, CT15 (02): : 138 - +
[8] On the time-domain transmission-line equations
Faria, JAB
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 1999, 22 (03) : 194 - 197
[9] ANALYSIS OF TIME RESPONSE OF LOSSY MULTICONDUCTOR TRANSMISSION-LINE NETWORKS
DJORDJEVIC, AR
SARKAR, TK
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1987, 35 (10) : 898 - 908
[10] TIME DOMAIN METHOD FOR OPTIMIZING TRANSMISSION-LINE MODEL
BOSE, S
BHATTACHARYYA, BK
PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 637 - 646

← 1 2 3 4 5 →