MCM-L PRODUCT DEVELOPMENT PROCESS FOR LOW-COST MCMS

被引：1

作者：

THOMPSON, P

机构：

[1] Motorola Semiconductor Products Sector, Tempe, AZ

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 01期

关键词：

MCM-L; NEW PRODUCT INTRODUCTION; QUALIFICATION;

D O I：

10.1109/96.365474

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

System size and cost reduction are often the largest factors for interest in commercial MCM's. Performance improvement is generally of secondary interest. Development and qualification can add significantly to the total cost of an MCM, so in addition to the normal desire to provide reliable products, the cost of doing so has gained increased importance. A new product introduction (NPI) process for low-cost MCM's has been implemented to rapidly provide cost-effective, reliable MCM solutions for cost-sensitive MCM users. The NPI process is based on three attributes: leverage single chip package (SCP) experience and technology, perform product family qualifications, and use only previously qualified silicon in MCM's. Application of the NPI process to the development and qualification of a 28 mm PQFP (Plastic Quad Flat Pack)-based MCM package is presented in this paper.

引用

页码：9 / 12

页数：4