RATE OF ELECTROLESS COPPER DEPOSITION BY FORMALDEHYDE REDUCTION

被引:49
作者
DUMESIC, J [1 ]
KOUTSKY, JA [1 ]
CHAPMAN, TW [1 ]
机构
[1] UNIV WISCONSIN, DEPT CHEM ENGN, MADISON, WI 53706 USA
关键词
D O I
10.1149/1.2401698
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:1405 / 1412
页数:8
相关论文
共 43 条
[1]  
ADAMSKY RF, 1963, 10 T S AM VAC SOC, P453
[2]  
ATKINSON EB, 1967, T J PLAST I, V35, P549
[3]  
BASSETT GA, 1958, J I MET, V87, P449
[4]  
BERENATO J, 1967, Patent No. 6614993
[5]  
BISSET T, 1966, Patent No. 1043233
[6]  
BLYTAS GC, 1970, Patent No. 3524754
[7]   SOME PROPERTIES OF ELECTROLESS COBALT [J].
CAVALLOTTI, P ;
SALVAGO, G ;
FRIEZE, AS ;
WEIL, R ;
SARD, R .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1969, 116 (06) :818-+
[8]   MOSSBAUER STUDY OF TIN(II) SENSITIZER DEPOSITS ON KAPTON [J].
COHEN, RL ;
DAMICO, JF ;
WEST, KW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (12) :2042-&
[9]  
DAVIS KC, 1969, Patent No. 1911041
[10]   A STUDY OF MECHANISM OF ELECTROLESS DEPOSITION OF NICKEL [J].
DONAHUE, FM ;
YU, CU .
ELECTROCHIMICA ACTA, 1970, 15 (01) :237-&