RAPID SOLIDIFICATION OF AG-CU AND AG-PB ALLOYS

被引：6
|
作者：
JACOBSON, N
机构：
[1] Department of Casting of Metals, Royal Institute of Technology, Stockholm
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1991年 / 133卷
关键词：
D O I：
10.1016/0921-5093(91)90137-C
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
A series of experiments on Ag-Cu and Ag-Pb alloys were performed in a wide range of compositions from 10 wt.% Cu to 25 wt.% Cu and from 1.2 wt.% Pb to 18 wt.% Pb. Each composition was solidified by three different cooling rates 10(3), 3 x 10(3) K s-1 and 10(5) K s-1. The Ag-Cu system showed a dendritic solidification with the lowest cooling rate and a diffusionless solidification with the highest cooling rate. The Ag-Pb system solidified in a cellular or dendritic morphology at all cooling rates and no diffusionless solidification was detected.
引用
收藏
页码：574 / 576
页数：3
相关论文
共 50 条
  • [41] RAPID DENDRITIC GROWTH IN UNDERCOOLED AG-CU MELTS
    WALDER, S
    RYDER, PL
    ACTA METALLURGICA ET MATERIALIA, 1995, 43 (11): : 4007 - 4013
  • [42] Microstructure formation in electrodeposition of highly supersaturated Cu-Pb and Ag-Pb layers
    Barthel, Th.
    Klimanek, P.
    Raub, Ch.J.
    Zielonka, A.
    Materials Science Forum, 1996, 228-231 (pt 2) : 475 - 480
  • [43] An electrochemical and XPS study of Ag-Pb binary alloys incorporated in Nafion® coatings
    Casella, IG
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 2001, 31 (04) : 481 - 488
  • [44] Debye temperature in binary alloys of the Al-Sn and Ag-Pb systems
    Stoimenov, S
    Stojanov, Z
    Skeparovski, A
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2003, 14 (10-12) : 777 - 778
  • [45] THERMODYNAMIC PROPERTIES OF AG-PB LIQUID SOLUTIONS
    KRUPKOWSKI, A
    FITZNER, K
    BULLETIN DE L ACADEMIE POLONAISE DES SCIENCES-SERIE DES SCIENCES TECHNIQUES, 1975, 23 (02): : 143 - 148
  • [46] Magnetic susceptibility of liquid Ag-Ge, Ag-Sn and Ag-Pb
    Terzieff, P
    Tsuchiya, Y
    JOURNAL OF PHYSICS-CONDENSED MATTER, 2001, 13 (15) : 3573 - 3582
  • [47] THE NATURE OF NON-EQUILIBRIUM SOLIDIFICATION OF UNDERCOOLED AG-CU ALLOYS IN CONTACT WITH PRIMARY COPPER DENDRITES
    PRASAD, YVSS
    RAO, PR
    CHATTOPADHYAY, K
    ACTA METALLURGICA, 1984, 32 (10): : 1825 - 1828
  • [48] Bulk and surface properties of liquid Ag-Cu, Ag-Sb and Cu-Sb alloys
    Ajayi, A. A.
    Oyeniyi, E.
    Oshakuade, O. M.
    PRAMANA-JOURNAL OF PHYSICS, 2023, 97 (02):
  • [49] EUTECTIC STRUCTURES OF AG-CU AFTER MELTING AND SOLIDIFICATION IN MICROGRAVITY AND ON EARTH
    BARBIERI, F
    PATUELLI, C
    METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1988, 19 (11): : 2659 - 2664
  • [50] Solidification behavior and microstructure of Ag-Cu eutectic alloy at different sub-rapid cooling rates
    Qin, QingYuan
    Li, JinFu
    Yang, Lin
    Liu, LianJie
    MATERIALS CHEMISTRY AND PHYSICS, 2024, 311
12345