RAPID SOLIDIFICATION OF AG-CU AND AG-PB ALLOYS

A series of experiments on Ag-Cu and Ag-Pb alloys were performed in a wide range of compositions from 10 wt.% Cu to 25 wt.% Cu and from 1.2 wt.% Pb to 18 wt.% Pb. Each composition was solidified by three different cooling rates 10(3), 3 x 10(3) K s-1 and 10(5) K s-1. The Ag-Cu system showed a dendritic solidification with the lowest cooling rate and a diffusionless solidification with the highest cooling rate. The Ag-Pb system solidified in a cellular or dendritic morphology at all cooling rates and no diffusionless solidification was detected.